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Results 1 - 20 of 20 matches |
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Comprehensive guidelines for cost-effective die casting production. Written for OEM product designers and engineers to aid in optimizing their part designs and specifications for custom production in Aluminum, Magnesium, and Zinc die casting alloys.
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| By : Mocana |
Published Date: Dec 10, 2009 |
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Most SSH implementations are built for PCs - that makes them too big and too slow for resource-constrained environments. Others force you to give up your source code under GNU terms. Mocana's FIPS 140-2 validated NanoSSH might be just what you're looking for. CLICK HERE to obtain your FREE TRIAL of Mocana's NanoSSH software.
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| By : Ramtron |
Published Date: Nov 12, 2009 |
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Today's technological innovation demands high performance coupled with low environmental impact. These dual requirements are driving components of the semiconductor industry which informs many global businesses and consumer lives.
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| By : APTX |
Published Date: Nov 05, 2009 |
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Viable distribution of Multi-channel Audio-over-IP for Live and Interactive "Voice Talent" based Gaming using High-quality, Low-latency Audio Codec technology.
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| By : APTX |
Published Date: Nov 05, 2009 |
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This paper discusses research undertaken to lower the complexity of existing high-quality sub-band ADPCM coding schemes to better satisfy these conflicting criteria.
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| By : APTX |
Published Date: Nov 05, 2009 |
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This paper examines the key performance aspects of low bit rate audio codecs for the next generation of bandwidth-efficient digital wireless microphone systems that meet the future needs of live events.
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| By : APTX |
Published Date: Nov 05, 2009 |
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This paper will present the case that there are a number of frailties associated with Dolby E, the
most notable of which are the latency, audio quality and general awkwardness in terms of
operation and implementation.
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| By : APTX |
Published Date: Nov 05, 2009 |
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This technology white paper introduces the reader to an entirely new scheme for lossless audio
compression called apt-X Lossless.
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This technology brief describes the architecture and the implementation of major technologies in HP ProLiant G6 c-Class server blades based on Intel Xeon processors. Much of the content of this paper is similar or identical to the content of a companion paper about the technologies in HP ProLiant G6 server blades based AMD Opteron processors because many of the same technologies have been implemented in both.
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Every professional mechanic or home handyman knows that you need the "right" tool to do the job. This entails making an initial investment to ensure that you have a complete set of screwdrivers, both slotted and Phillips-head, and a complete set of wrenches, both open-end and box-end, standard and metric, to be sure that you can handle any requirement, as well as a set of hex keys or Allen wrenches, in addition to any number of power tools. Download this white paper and learn more.
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"As the number of enhancements to various Hardware Description Languages (HDLs) has increased over the past year, so too has the complexity of determining which language is best for a particular design. Many designers and organizations are contemplating whether they should switch from one HDL to another.
This paper compares the technical characteristics of three, general-purpose HDLs.
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Join us at ESC Boston, September 21-24 at the Hynes Convention Center, in Boston, MA. Expo registration is FREE, and advanced registration pricing is still available for conference packages.
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| By : Belden |
Published Date: Aug 21, 2009 |
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This paper provides recommendations and tips for accomplishing this by discussing: considerations for the wiring closet, identification of all network requirements, trends and tools for planning the placement of Access Points, decision factors to consider for combined networks, technology trends and standards, power level requirements, cable deployment and many other factors that impact the optimization of performance and reliability of combine wired and wireless networks. Learn more today!
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A powerful signal integrity analysis tool must be flexibility, easy to use and integrated into an existing EDA framework and design flow. In addition, it is important for the tool to be accurate enough. This report reviews a validation study for the Mentor Graphics HyperLynx 8.0 PI tool to establish confidence in using it for power integrity analysis.
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For advanced signaling over high-loss channels, designs today are using equalization and several new measurement methods to evaluate the performance of the link. Both simulation and measurement tools support equalization and the new measurement methods, but correlation of results throughout the design flow is unclear. In this paper a high performance equalizing serial data link is measured and the performance is compared to that predicted by simulation. Then, the differences between simulation and measurements are discussed as well as methods to correlate the two.
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High Density Interconnect (HDI) is being used more often to meet the growing need for more complex designs in smaller form factors. Beyond some of the more obvious electrical effects of using smaller vias, there is also an impact to the power integrity of a board using HDI. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This paper will examine and quantify these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI.
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The success of any consumer electronic device depends to a large extent on the appeal of the user interface (UI) and how easy the device is to use. Studies show that good cosmetic design can encourage users to explore the full range of features and often engenders the perception that a product is easier to use. So if the benefits of a great looking, easy-to-use UI are so clear, why are so many products still falling short of customer expectations? The solution lies in taking a fresh new approach a consumer electronic device UI plays. By identifying common UI functionality and implementing it in a reusable and customizable way, we can make it far easier for embedded engineers to deliver visually engaging and easy-to-use consumer electronic products.
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Moving to C++ presents opportunities for higher programmer productivity. The requirements of embedded systems, however, demand that the adoption of C++ be carefully measured for the performance impact of run-time costs present in C++, but not in C. This talk suggests strategies for developers who are starting their acquaintance with C++.
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| By : IBM |
Published Date: Sep 02, 2009 |
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This webcast presents an easy to follow process that you can use to capture requirements and specify a system architecture.
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| By : IBM |
Published Date: Sep 02, 2009 |
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This webcast presents the IBM® Rational® HarmonyT for Systems Engineering process for the model-based systems development.
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