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Results 1 - 19 of 19 matches |
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| By : Tripwire |
Published Date: Jun 30, 2009 |
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Find out how a robust configuration audit and control system can enable electronic submissions and signatures, and validate electronic data, in compliance with the FDA's mandatory submission of clinical trials records.
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| By : Belden |
Published Date: Jun 02, 2009 |
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This paper provides recommendations and tips for accomplishing this by discussing: considerations for the wiring closet, identification of all network requirements, trends and tools for planning the placement of Access Points, decision factors to consider for combined networks, technology trends and standards, power level requirements, cable deployment and many other factors that impact the optimization of performance and reliability of combine wired and wireless networks. Learn more today!
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No question the UI in electronic devices today is playing a larger role in the success of a device. Get the UI wrong and your product will have little chance of surviving. And it isn’t enough to deliver a UI that is merely functional: it has to look good too. Studies have shown that a good cosmetic design can encourage users to explore the full range of features and often, can engender the perception that a product is easier to use, which can make consumers more tolerant of product deficiencies. Learn more today!
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A powerful signal integrity analysis tool must be flexibility, easy to use and integrated into an existing EDA framework and design flow. In addition, it is important for the tool to be accurate enough. This report reviews a validation study for the Mentor Graphics HyperLynx 8.0 PI tool to establish confidence in using it for power integrity analysis.
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For advanced signaling over high-loss channels, designs today are using equalization and several new measurement methods to evaluate the performance of the link. Both simulation and measurement tools support equalization and the new measurement methods, but correlation of results throughout the design flow is unclear. In this paper a high performance equalizing serial data link is measured and the performance is compared to that predicted by simulation. Then, the differences between simulation and measurements are discussed as well as methods to correlate the two.
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High Density Interconnect (HDI) is being used more often to meet the growing need for more complex designs in smaller form factors. Beyond some of the more obvious electrical effects of using smaller vias, there is also an impact to the power integrity of a board using HDI. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This paper will examine and quantify these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI.
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The success of any consumer electronic device depends to a large extent on the appeal of the user interface (UI) and how easy the device is to use. Studies show that good cosmetic design can encourage users to explore the full range of features and often engenders the perception that a product is easier to use. So if the benefits of a great looking, easy-to-use UI are so clear, why are so many products still falling short of customer expectations? The solution lies in taking a fresh new approach a consumer electronic device UI plays. By identifying common UI functionality and implementing it in a reusable and customizable way, we can make it far easier for embedded engineers to deliver visually engaging and easy-to-use consumer electronic products.
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Moving to C++ presents opportunities for higher programmer productivity. The requirements of embedded systems, however, demand that the adoption of C++ be carefully measured for the performance impact of run-time costs present in C++, but not in C. This talk suggests strategies for developers who are starting their acquaintance with C++.
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This white paper explores the challenges of increasing computing power in both an inflexible and resource-constrained physical space, as well as centers that are experiencing high growth. We also explore how companies can employ emerging support technology – like intelligent power distribution units (PDUs) – to help manage server uptime and capacity planning.
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Uninterruptible Power Solutions are often solved at the facility level with unnecessarily large, inefficient, expensive and complex AC UPS systems. While this provides an easy demarcation line between the facility and end equipment, with each focusing on a different part of the problem, it also results in overall operating efficiency and total cost of ownership being difficult to ascertain and optimize.
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Modern Electronic Systems are quite often powered from a three-phase power source. While utilizing power modules that operate directly from three-phase power might seem to provide optimal simplicity and flexibility, the added complexity required to realize three-phase power factor corrected circuitry usually negates any potential savings.
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Electronics and Software Engineering are quickly merging with traditional Mechanical Engineering to create a new paradigm in auto manufacturing: Mechatronics. Industry experts predict that this shift will bring about profound advances in automotive product development. Unfortunately, existing IT and process infrastructures do not provide sufficient capabilities to support the new paradigm: multiple data silos, a lack of standardized processes, and integration issues on a tool level (Mechanical, Electronic, Software) continue to pose serious obstacles to development efficiency, and remain a frequent source of delays, quality issues and cost increases.
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PTC, the Product Development Company® today announced that Samsung Electronics Co., LTD (SEC), a leading digital products manufacturer of mobile phones, televisions, and semiconductors, has selected PTC Windchill as its digital product development data repository to manage an integrated BOM of mechanical, electrical and software data across its globally distributed product development environment. Windchill is the standard enterprise PLM solution at SEC because of its powerful, Web-based support of key product development processes on a single technology architecture and execution environment.
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| By : Ericsson |
Published Date: Feb 06, 2009 |
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Using digital control in power supplies is considerably more flexible than analog control in its ability to adapt to changes and digital control inside the power supply results in advantages to the system application such as improved efficiency, fewer external components and reduced overall cost.
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| By : Recom |
Published Date: Feb 06, 2009 |
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“Medical grade DC/DC converters” is an often used, but more often abused, description of a class of converters that are increasingly in demand. What are actually the particular requirements that medical applications place on DC/DC converters?
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| By : Eaton |
Published Date: Feb 06, 2009 |
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Power distribution units (PDUs) are vital to the management of power to IT arrays and have evolved from a simple panel of switches and outlets to designs that can now be considered "intelligent" through the inclusion of internal processing capabilities.
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Since the very first Digital Power Forum which took place in 2004, many articles have been written touting the general advantages of using digital control. It was at this time that ROAL Electronics introduced into the marketplace the first digitally controlled DC-DC converter.
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National Instruments LabVIEW is a dataflow programming language, developers can write inherently parallel applications that can map to parallel hardware such as multicore processors and FPGAs for optimal performance. This white paper discusses dataflow programming and why NI LabVIEW is ideal for programming multicore systems.
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This article introduces the three levels of data-logging software for use with National Instruments DAQ devices – NI LabVIEW SignalExpress, NI LabVIEW SignalExpress LE and NI LabVIEW.
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More Electronics Topics |
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Analog Communications, Digital Signal Processing, Electronic Design Automation, System On A Chip, Electronic Test and Measurement, Embedded Design, Boards & Modules, Embedded Systems and Networking, Electromechanical & Mechanical, Optoelectonics & Displays, Packaging and Interconnects, Passive & Discrete Components, Power Sources & Conditioning Devices, Integrated Circuits and Semiconductors, Sensors & Actuators |
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